CiPro Technology Solutions
a Woman Owned Small Business
CiPro Technology Solutions LLC is dedicated to providing innovative strategies and technology solutions. Headquartered in Florida with offices in Connecticut, we specialize in helping companies, particularly those with commercial technologies, navigate and penetrate the complex defense industry and Department of War (DoW) market. Our overarching mission is to strategically bridge the gap between commercial innovation and vital Warfighter needs.
The ATLAS Consortium
Advanced Textile & Linked Apparel Systems
A University-Industry Partnership to Advance Smart Textile Manufacturing
The collaboration between the University of Florida, CiPro Technology Solutions, Connecticut Center for Advanced Technology (CCAT), and Fibrotex USA represents an exemplary framework for translating fundamental research into tangible societal and economic benefits. This partnership is strategically designed to overcome critical barriers in the domestic manufacturing of smart textiles by a patented advancing copper (Cu) electroplating technique, enabling next-generation wearable systems for health, defense, first responder, athletic and fashion industries.
The Technology
The Problem: Bulky Systems
Modern smart garments are currently hindered by "wire issues"—heavy external battery packs, snag-prone cables, and sensors that often fail due to glue peeling or high-resistance conductive threads. These limitations impact comfort, reliability, and long-term durability. The industry requires a solution that combines the flexibility of fabric with the electrical quality and reliability of a Printed Circuit Board (PCB).
Our Solution: The Manufacturing Breakthrough
The ATLAS Consortium uses a patented three-step "Mission Build" process that enables Expeditionary Manufacturing:
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Laser Scribing: Converts fabric into a conductive graphene template without compromising material integrity.
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HEA Metallization: Employs a patented process that grows porous copper nanostructures into fabric fibers at rates over 1,000 times faster than conventional electroplating.
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Passivation: An automated, superhydrophobic coating process that ensures extreme durability against washing, stretching, and rolling.
Strategic Focus: Materials, Manufacturing, and Structures
By introducing a localized Hydrogen Evolution Assisted (HEA) electroplating method that deposits copper over 1,000 times faster than conventional electroplating methods, ATLAS addresses the "breaking the tension between performance and efficiency" for critical production processes.
The Principle Investigators
Ms. Kristin Wilson
Principle Investigator/ATLAS Project Lead
Strategic leader specializing in capture planning and execution, business development, and business & contract management. Expertly bridges commercial innovations with complex market needs, leveraging her background in federal and defense sectors to drive growth and deliver high-performance protective solutions.
Dr. Arash Takshi
Principal Investigator
PhD in Electrical Engineering with experience in research on organic and thin film devices, including organic/bio photovoltaic devices, organic transistors, and organic diodes. Expert in design, modeling, fabrication, characterization, and optimization of organic electronic devices. Experienced in industry in design and implementation of electronic circuits for control and automation (digital and analog).
Dr. Ehsan Sheybani
Principal Investigator
Main research area has been in applications of communication, signal processing and data analysis. Experienced in teaching, practicing, researching and consulting applications of DSP in technology, system analysis and data sciences for the past 20 years. Publications and research grants include projects with NASA, NSF, NIH, DoD, DEd and industry partners.
How to Get Involved
The ATLAS Consortium is seeking strategic partners to accelerate the transition of this technology from a TRL 4/5 to commercial/global mass production. We invite industry leaders and investors to help bring this project forward through the following avenues:
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Technology Insertion: We are open to Industry partners who can help bridge this capability into defense, first responder, healthcare, athletics and fashion industries.
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Manufacturing & Scalability Support: We are looking for collaborators with the infrastructure to help transition into a robust, marketable system for large-surface-area printing and mass production.
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Operational Integration: We invite organizations that can facilitate the deployment of "in-theater" smart-uniform repair capabilities or help integrate this technology into specialized apparel for first responders, aerospace, and the military.