


CiPro Technology Solutions
a Woman Owned Small Business
MISSION STATEMENT
Our mission is to empower partners through the full lifecycle of innovation. We provide the strategic framework to move products from initial development to commercial launch, while simultaneously forging the partnerships necessary to navigate and scale commercial technologies within the defense sector.
The ATLAS Consortium
Advanced Textile & Linked Apparel Systems
A University-Industry Partnership to Advance Smart Textile Manufacturing
The collaboration between the University of Florida, CiPro Technology Solutions, Bio Dynamic Coatings, CT Center for Advanced Technology (CCAT), and Fibrotex USA represents an exemplary framework for translating fundamental research into tangible societal and economic benefits. This partnership is strategically designed to overcome critical barriers in the domestic manufacturing of smart textiles by advancing copper (Cu) electroplating techniques, enabling next-generation wearable systems for health, defense, and communication.

The Technology
The Problem: Bulky Systems
Modern smart garments are currently hindered by "wire issues"—heavy external battery packs, snag-prone cables, and sensors that often fail due to glue peeling or high-resistance conductive threads. These limitations impact comfort, reliability, and long-term durability. The industry requires a solution that combines the flexibility of fabric with the electrical quality and reliability of a Printed Circuit Board (PCB).
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Our Solution: The Manufacturing Breakthrough
The ATLAS Consortium uses a patented three-step "Mission Build" process that enables Expeditionary Manufacturing:
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Laser Scribing: Converts fabric into a conductive graphene template without compromising material integrity.
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HEA Metallization: Employs a patented process that grows porous copper nanostructures into fabric fibers at rates over 1,000 times faster than conventional electroplating.
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Passivation: An automated, superhydrophobic coating process that ensures extreme durability against washing, stretching, and rolling.
Strategic Focus: Materials, Manufacturing, and Structures
By introducing a localized Hydrogen Evolution Assisted (HEA) electroplating method that deposits copper over 1,000 times faster than conventional electroplating methods, ATLAS addresses the "breaking the tension between performance and efficiency" for critical production processes.
Meet The Team
How to Get Involved
The ATLAS Consortium is seeking strategic partners to accelerate the transition of this technology from a laboratory environment to global mass production. We invite industry leaders and investors to help bring this project forward through the following avenues:
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Financial Investment: We are seeking capital to fund the scaling of the printer (patent-pending) and to support the startup launch.
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Technological Collaboration: We welcome partners who can provide engineering expertise to optimize the multi-functional printer head, enhance the AI-driven self-adaptive control systems, or refine superhydrophobic passivation formulas.
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Manufacturing & Scalability Support: We are looking for collaborators with the infrastructure to help transition into a robust, marketable system for large-surface-area printing and mass production.
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Operational Integration: We invite organizations that can facilitate the deployment of "in-theater" smart-uniform repair capabilities or help integrate this technology into specialized apparel for first responders, aerospace, and the military.



